SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chips (TSMC-SoIC) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time.

SUNNYVALE, Calif., Sept. 27, 2023 /PRNewswire/ – Synopsys, Inc. (Nasdaq: SNPS) today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric™ technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC’s leading N3E process for seamless die-to-die connectivity.

SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence; Integrity™ 3D-IC platform to support the TSMC 3Dblox™ standard for 3D front-end design partitioning in complex systems. Through this latest collaboration, the Cadence flows are optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS;) and System-on-Integrated-Chips (TSMC-SoIC) technologies. By using these design flows, customers can accelerate the development of advanced multi-die package designs for emerging 5G, AI, mobile, hyperscale computing and IoT applications.

MOUNTAIN VIEW, Calif., April 24, 2023 /PRNewswire/ -- Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (Nasdaq: SNPS) has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing. Synopsys provides the industry's most comprehensive EDA and IP solutions for multi-die systems on TSMC's advanced 7nm, 5nm and 3nm process technologies with support for TSMC 3DFabric™ technologies and 3Dblox™ standard. The integration of Synopsys implementation and signoff solutions and Ansys multi-physics analysis technology on TSMC processes allows designers to tackle the biggest challenges of multi-die systems, from early exploration to architecture design with signoff power, signal and thermal integrity analysis.

To address the rising complexity of 3D IC design, TSMC introduced the 3Dblox standard to unify the design ecosystem with qualified EDA tools and flows for TSMC 3DFabric technology. The modularized TSMC 3Dblox standard is designed to model, in one format, the key physical stacking and the logical connectivity information in 3D IC designs. TSMC has worked with EDA partners in the 3DFabric alliance to enable 3Dblox for every aspect of 3D IC designs, including physical implementation, timing verification, physical verification, electro-migration IR drop (EMIR) analysis, thermal analysis, and more. TSMC 3Dblox is designed to maximize flexibility and ease of use, offering ultimate 3D IC design productivity.