The 3rd 3DFabric Alliance Workshop includes a TSMC presentation with the latest 3Dblox 2.0 status, which is a major milestone that enables feasibility study features for prototyping.

It was held on the next day of 2023 TSMC technology Symposium with 20 members.
In addition to TSMC and partner presentations, there were two customer presentations that shared their perspectives of 3DIC design challenges for pointing the directions under the scope of 3DFabric Alliance collaboration among members.

The first All-Partners meeting with 19 founding members after the official announcement of 3DFabric Alliance in October 2022 at TSMC OIP Ecosystem Forum.
There were TSMC presentations on 3DFabric technology, 3Dblox status and 3DIC Testing Trend & Challenges, as well as partner presentations by IBIDEN, Samsung Memory, Cadence and Synopsys on EDA & IP respectively.

The press meeting at the 2022 OIP was all about 3DFabric and 3Dblox. If you don't know what those are, then read on. I've said before that advanced packaging is the hottest area in semiconductors right now